e-con Systems launched Advanced Multi-Camera Solutions for Qualcomm Robotics RB5 Kit
e-con Systems launched an extensive multi-camera solution to fully unlock the Qualcomm Robotics RB5 Kit' potential. This solution allows connecting up to...
Infineon extends AURIX TC3xx MCAL by adding support for AUTOSARv4.4.0 to the existing AUTOSARv4.2.2...
Infineon Technologies extends its AURIX TC3xx MCAL by adding support for AUTOSARv4.4.0 to the existing AUTOSARv4.2.2 MCAL. This facilitates software development for...
STM32CubeProgrammer 2.13, STM32CubeMonitor 1.6, & STM32CubeMonitor-RF 2.11: see how power users get more productive...
ST often releases new versions of STM32CubeProgrammer, STM32CubeMonitor, STM32CubeMonitor-RF, and STM32CubeMonitor-UCPD. The tools often appear in our columns because many STM32 developers use them to release their...
Renesas launches new MCUs for Motor Control applications
Renesas Electronics Corporation debuted three new groups of MCUs for Motor Control applications. Renesas is introducing over 35 new products, including devices...
Variscite demonstrated i.MX 91-based System on Module at COMPUTEX
Variscite presented a working demonstration of the new VAR-SOM-MX91 System on Module at COMPUTEX 2023 conference in simultaneity with NXP's announcement of the i.MX 91 SoC.
AAEON to showcase upcoming Product Demonstrations during COMPUTEX 2023
With COMPUTEX 2023 taking place from May 30th to June 2nd, 2023 at the Taipei Nangang Exhibition Center, AAEON will showcase both...
Synopsys & Arm Strengthen to bring next-gen Mobile SoC Designs on the Most Advanced...
Tackling extremely complex mobile chip designs on advanced nodes down to 2nm, Synopsys has strengthened its AI-enhanced design collaboration with Arm as the...
Numato Lab unveil System on Module based on Travos: AMD Zynq UltraScale+ MPSoC
Numato Lab introduces a powerful SOM (System on Module) based on AMD Zynq UltraScale+ MPSoC is a powerful and flexible embedded system...
Cambridge GaN Devices has introduced a range of Application Interface Boards
Cambridge GaN Devices new Application Interface Boards enable users to try icegan ics in existing designs without pcb re-layout
Molex Unveils Chip-to-Chip 224G Product Portfolio for Next-Gen Data Centers & Generative AI Applications
Molex has introduced the industry’s first chip-to-chip 224G product portfolio, encompassing next-gen cables, backplanes, board-to-board connectors and near-ASIC connector-to-cable solutions operating at...
