SHENMAO America, Inc. is excited to introduce the SHENMAO Unveils Advanced Low-Temperature Lead-Free Solder Wire PF735-LT201, now available for the electronics industry. This cutting-edge solder wire is expertly crafted to cater to the dynamic requirements of modern electronics, delivering exceptional soldering quality and dependability for low-temperature PCBA soldering and rework procedures.
The development of PF735-LT201 is a result of an in-depth comprehension of industry trends and challenges. In response to the increasing demand for ultra-thin packages, which often leads to package warpage and decreased production yields, SHENMAO presents an innovative solution. The solution involves a low-melting-point, lead-free no-clean solder wire, meticulously designed to optimize low-temperature PCBA soldering and rework processes.
The PF735-LT201 solder wire boasts a range of exceptional features, setting a new benchmark for soldering technology. The solder wire achieves remarkable solderability by incorporating special low-temperature rosin and activators, ensuring optimal adhesion and a strong bond. The soldering process with PF735-LT201 results in colorless flux residue, thanks to the inclusion of special surfactants.
PF735-LT201 is halogen-free (ROL0) and fully compliant with RoHS, RoHS 2.0, and REACH regulations, aligning with SHENMAO’s commitment to environmental responsibility. With reduced splash and smoke during soldering, PF735-LT201 enhances the working environment while delivering excellent solder joint strength, reliability and resistance to thermal and mechanical fatigue.
SHENMAO’s LTS materials have the unique capability to reduce reflow temperatures, thereby decreasing PCB and substrate deformation. This results in improved production yield rates and elevated quality standards.
Discover the cutting-edge PF735-LT201 solder wire and experience the future of low-temperature soldering. For more information, please visit www.shenmao.com.
