Indium Corporation, an advanced materials innovator, proudly assumes the role of a Gold Sponsor at IPC’s Integrated Electronics Manufacturing & Interconnections (IEMI) 2023. The company is excited to showcase its cutting-edge materials for e-Mobility and offer its technical expertise during the event in Pune, India on August 3.
Indium Corporation has consistently supported the Make in India campaign and remains dedicated to serving the burgeoning electronics market in India. Its participation in IEMI 2023 reaffirms its commitment to contributing to India’s electronics industry, both now and in the coming years.
“With our facility in Chennai, Indium Corporation is well positioned to support regional demand for consumer and infrastructure electronics, such as EV manufacturing, mobile, 5G, and semiconductors,” said Senior Country Sales Manager Damian Santhanasamy. “We look forward to serving the Indian electronics market, not only with our innovative materials, but by providing local technical expertise.”
Additionally, Associate Director for Global Technical Service & Application Engineering Jonas Sjoberg will participate in an expert panel discussion titled Importance of Electronics in Electric Vehicles. Sjoberg has more than 25 years of technical experience in the electronics industry, including developing and deploying leading-edge designs and processes for packaging and assembly; managing research and development projects and facilities; and serving as technical advisor to internal and external design, development, and manufacturing sites worldwide.
With its significant automotive industry expertise and an award-winning portfolio of proven products, Indium Corporation will feature its Rel-ion™ suite of electrical, mechanical, and thermal solutions which are designed to be reliable, scalable, and proven materials to reduce electric vehicle (EV) manufacturers’ time to market. More than three million EVs are currently on the road with Indium Corporation’s Rel-ion products.
Rel-ion material solutions deliver reliability by:
- Eliminating non-wet opens and head-in-pillow defects
- Preventing dendritic growth by meeting stricter surface insulation resistance requirements
- Preventing solder delamination with precise bondline control and increased creep and fatigue resistance
- Reducing hot spots-induced voiding through improved thermal efficiency
